Delivery Order FA867219D0001-FA867219F1101

Raytheon Company, through its Missile Defense Division, received a delivery order valued at $101.6 million on September 30, 2019, for the Small Diameter Bomb Increment II (SDB II) program, with performance extending through December 31, 2029. This cost-plus-fixed-fee delivery order supports the Air Force Life Cycle Management Center at Eglin Air Force Base in the development and production of precision-guided, air-launched glide munitions designed to engage both fixed and moving targets. The SDB II is classified as a Major Defense Acquisition Program under Acquisition Category IC within the Major Capability Acquisition pathway and represents a significant advancement in air-to-ground weapons capabilities for tactical aircraft across the U.S. Air Force, Navy, and Marine Corps. The contract was awarded without a small business set-aside designation and includes primary performance in Tucson, Arizona.

The delivery order supports production of advanced munitions systems through a robust supply chain managed by Raytheon. Key subcontractors include NXP USA, providing specialized semiconductor components such as HAM wafers; Semiconductor Components Industries (ON Semiconductor), supplying readout wafers and integrated circuits; Coherent Thermal Solutions, providing ceramic parts; and various specialized electronics manufacturers including Astronic, SCI Technology, Pacific Scientific, Encoder Products, SMT Corp, and Torotel. These subcontractors collectively provide critical electronic components, semiconductor materials, thermal management solutions, ordnance components, and precision engineering support necessary for SDB II munition production and integration.